ʻO Semiconductor Alumina Ceramic Plate ʻAlua Surface Grinding Lapping Solution

Mīkini Model:  YH2M84100 Mīkini Hoʻopālua Disk Grinding Lapping Machine

Mea hana:  Semiconductor Alumina Ceramic Plate-59*59* T 26.45mm

koi:  Paha 0.003mm, Kaulike 0.007mm, Roughness Ra0.8μm;

Results:  Flatness≤0.001mm， Parallelism≤0.002mm，Ra0.8μm；

• Nā noi nui o nā seramika alumina semiconductor:

    1. Mea hoʻopili uila uila: hoʻohana ʻia no ka IC packaging a me nā modula mana, me ka insulation kiʻekiʻe a me ka conductivity thermal maikaʻi. 

    2. Chip paʻa: hāʻawi i ke kākoʻo mechanical, insulation a me ka thermal stability. 

    3. Mea Radiator: hoʻohana ʻia no nā mea mana kiʻekiʻe e hoʻomaikaʻi i ka hana hoʻopau wela. 

   4. ʻO nā mea hoʻoheheʻe a me nā meaʻike: hoʻohanaʻia i ka wela wela a me nā kaiapuni palekana.

• ʻO ka semiconductor alumina ceramic sheet surface grinding a me nā koi kaʻina hana polishing:

1.  ʻO ka wili ʻana: Pono ka huila wili daimana e hōʻoia i ka hana kiʻekiʻe kiʻekiʻe o nā mea paʻakikī kiʻekiʻe a me ka mālama ʻana i ka palahalaha a me ka ʻōpala.

2.  Polishing: ʻO ka hana maikaʻi ʻana i nā ʻanuʻu he nui e hōʻoia i ka pau ʻana o ka ʻili a hoʻololi i nā noi semiconductor kiʻekiʻe.

3. Ka mana ana: E hoʻomalu pono i ka hoʻomanawanui e pale i ka deformation thermal a me ka deviation dimensional e hōʻoia i ka kūlike o ka huahana.