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Semiconductor Grinding Lapping Machine

ʻO ʻoe ʻoe: Kahua>Nā huahana- TJNE>Semiconductor Lapping Machine Polishing>Semiconductor Grinding Lapping Machine

pololei
222
hili ana
ʻO ka mīkini hoʻoliʻi kiʻekiʻe kiʻekiʻe kiʻekiʻe i ka ʻili no ka sapphire SiC Glass Semiconductor
ʻO ka mīkini hoʻoliʻi kiʻekiʻe kiʻekiʻe kiʻekiʻe i ka ʻili no ka sapphire SiC Glass Semiconductor
ʻO ka mīkini hoʻoliʻi kiʻekiʻe kiʻekiʻe kiʻekiʻe i ka ʻili no ka sapphire SiC Glass Semiconductor

ʻO ka mīkini hoʻoliʻi kiʻekiʻe kiʻekiʻe kiʻekiʻe i ka ʻili no ka sapphire SiC Glass Semiconductor


ʻO kēia kikoʻī kiʻekiʻe mīkini hoʻopololei ua hoʻolālā kūikawā ʻia no nā huahana semiconductor. He kūpono ia no ka wili ʻana a me ka poli ʻana o ka sapphire, silicon carbide (SiC), keramika a me nā mea ʻē aʻe e hoʻokō i kāu ʻimi hope loa o nā ʻili kiʻekiʻe.

nā huahana semiconductor

ninau
Nā huapalapala ʻenehana

helehelena:

1. Ua hoʻolālā ʻia ka mīkini me ka paʻa maikaʻi a me ka pololei kiʻekiʻe. Hoʻohana ʻia ka loiloi element palena i ka hoʻolālā ʻana o nā ʻāpana koʻikoʻi. He pae pololei nā ala alakaʻi a me nā bearings a pau. ʻO ka wikiwiki kiʻekiʻe loa o ka disc polishing he 60r/min, a ʻo ka wikiwiki kiʻekiʻe loa o ka disc workpiece he 60r/min, me ka pono polishing kiʻekiʻe;

2. Hiki i nā ʻoki hana ʻehā ke hoʻomalu pākahi i ke kaomi polishing, ka manawa polishing, a me ka wikiwiki, a hiki ke hana i ka hana ʻokoʻa;

3. Mālama nā lako i nā kūlana hoʻouka a hoʻokuʻu aunoa no ka hoʻonohonoho maʻalahi o ka automation;

4. Hoʻohana ʻia ka hāmeʻa palekana holoʻokoʻa, ʻoi aku ka launa pū ʻana o nā lako a me ka palekana, a ua kau ʻia kahi pale kukui palekana ma ka ʻaoʻao hana lima;

5. Hoʻohana ʻia ka mana PLC, nui ka hiki ke mālama i ka ʻikepili meaʻai, a hiki ke mālama ʻia he 100 mau meaʻai. Hiki ke hana ʻia kahi meaʻai hoʻokahi i 10 mau ʻāpana;

6. Me ka hōʻike ʻana o ka pale paʻi a me ka hana, he launa pū ka interface kanaka-mīkini, a hoʻohana kēlā me kēia sensor kī i ka hōʻike parameterized no ka hana maʻalahi a me ka kaohi.

Auana

ʻAʻole

'ikamu

kiko'î

1

Anawaena o ka Lapping Disc

φ1422mm

2

Ke anawaena o ka disc workpiece

Ф550mm

3

Ka wikiwiki o ka wili ʻana o ka Disc Lapping

5 ~ 60r / min

4

Ka wikiwiki o ke koʻokoʻo hana

5 ~ 60r / min

5

Kaomi poli ʻoi loa o hoʻokahiKālī

500Kg

6

Ka Palahalaha o ka Lapping Disc

0.01mm

7

Holo ʻana o ka helehelena pau ʻoleo ka Lapping Disc

0.01mm

8

Ka pālahalaha o ka Disc Workpiece

0.005mm

9

Ana laulā(LxWxH)

Ma kahi o 2150 × 2050 × 3020mm

10

MakerWʻewalu

Ma kahi o 8800Kg

11

Huina Mana

30KW

palapala

palapala hoʻomaikaʻi

Hoʻokumu kā mākou hui R & D i kahi pilina lōʻihi me ke Kulanui ʻOihana Palekana o ke Kulanui ʻo Dalian, ke Kulanui ʻo Hunan, ke Kulanui ʻo Central South, a me nā ʻoihana kaulana ʻē aʻe. ʻO Yuhuan kekahi kahua noiʻi no ka haumāna kauka o ke Kulanui ʻo Hunan, loaʻa iā ia he 5-9 mau palapala sila i kēlā me kēia makahiki. Loaʻa iā ia he 36 mau palapala sila e pili ana. Ua hala ka palapala hōʻoia o nā huahana kūlana honua i ka makahiki 2005 i ka ISO9001: 2000 palapala hōʻoia ʻōnaehana maikaʻi honua, ua hoʻokumu i nā kūlana huahana ʻoihana.

Hoʻopili a me ka lawe ʻana

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1. Moisture-proof packaging + Wooden Box.
2.Special packing koi i loaʻa.

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